Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced it is ...

All eyes are on Jensen Huang ahead of the March 16–19 GTC conference. Nvidia's chief executive has promised to unveil a chip unlike anything the world has seen before —and speculation is now mounting ...

Taalas and Etched are two AI chip startups aiming to challenge Nvidia’s dominance in the AI hardware market. Etched is using ASIC chips. Taalas is using eASIC chips. They are both putting the logic ...

Fitipower, a Taiwanese driver IC and semiconductor supplier, offered a cautiously optimistic outlook for 2026 during its February 25 investor briefing. Chairman Young Lin said the company expects full ...

The fabricated D-band transmitter/receiver chipset: (Top) Transmitter, (Bottom) Receiver,(Left) CMOS transmitter/receiver IC, (Middle) Flip-chip mounted IC chip, and (Right) Entire board. A new D-band ...

A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology The Cadence Integrity ™ 3D-IC Platform now features enhanced support for improved ...