PHOENIX--(BUSINESS WIRE)--Spirit Electronics, a value-added microelectronics distributor, is rolling out additional capacity for its automated BGA reballing service. Spirit’s high-efficiency ...

The physical characteristics of lead-free solder impose new defect types that test and inspection techniques must address. For example, lead-free solder's higher melting point and reduced wetting, ...

SHENMAO America, Inc. is excited to introduce its Lead-Free Solder Paste PF606-P, designed specifically for the “Reverse Hybrid” assembly process. This new approach is revolutionizing board assembly ...

ANAHEIM, Calif. — Agilent Technologies Inc. continues to try and bring electronics manufacturing test into the third dimension. The Palo Alto, Calif.-based ATE company unveiled the SJ50 Series II, its ...

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

Intel’s dual-core processors have been described as “nothing short of amazing” by reverse engineering firm Chipworks, following analysis of the Presler processor core. Presler, at the core of Intel’s ...